Dispensing machine this dispensing technology equipment is simple, only using pulsating air pressure and needle tube can achieve point. It is suitable for medium viscosity colloid with low cost and convenient operation and maintenance.

　　在半导体封装设备中，70%以上的点胶机采用这种技术。但是，它也存在不足之处。在点胶过程中，压缩空气反复压缩胶体，会使其产生热量，从而影响胶体的粘度；随着针筒内剩余的胶体越来越少，针筒内气体的体积越来越大，将这些气体压缩到一定压强就需要更多的时间。在高速点胶时，对这些因素的控制更是困难。

　　In semiconductor packaging equipment, more than 70% of dispensers use this technology. However, it also has shortcomings. In the dispensing process, the compressed air repeatedly compresses the colloid, which will generate heat, thus affecting the viscosity of the colloid; as the remaining colloid in the syringe is less and less, the volume of the gas in the syringe is larger and larger, it will take more time to compress these gases to a certain pressure. When dispensing at high speed, it is more difficult to control these factors.

　　点胶机在定量点胶过程中，更基本的要求是在整个点胶过程中保持胶体流速和点胶效果一致。胶的有效使用要求掺和许多的因素，包括产品设计问题，来适应充胶工艺和产品需要。随着电路的密度增加和产品形式因素的，电子工业已出现许许多多的新方法，将芯片级的设计更紧密地与板级装配结合在一起。

　　In the process of quantitative dispensing, the most basic requirement of dispensing machine is to keep the gel flow rate and dispensing effect consistent in the whole dispensing process. The effective use of glue requires many factors, including product design, to meet the needs of filling process and products. With the increase of circuit density and the elimination of product form factors, many new methods have emerged in the electronic industry, which combine chip level design with board level assembly more closely.

　　在某种程度上，诸如倒装芯片和芯片级包装等技术的出现事实上已经模糊了半导体芯片、芯片包装方法与印刷电路板装配级工艺之间的传统划分界线。

　　To some extent, the emergence of technologies such as flip chip and chip level packaging has in fact blurred the traditional demarcation line between semiconductor chip, chip packaging method and PCB assembly level process.