点胶机在点胶时要注意什么?
在点胶机行业中,出产中容易呈现以下几个问题,好比胶点巨细不匹配、拉丝、胶水浸染焊盘、固化强度不好易掉片等。解决这些问题应整体研究各项技术工艺参数,从而找到解决问题的法子。
In the dispensing machine industry, the following problems are easy to appear in production, such as mismatch of glue point size, wire drawing, glue-impregnated pad, poor curing strength and easy chip dropping. To solve these problems, we should study the technological parameters as a whole so as to find a way to solve the problem.
那么如何解决点胶机在行业的这些问题呢?具体有以下几点来解决点胶机呈现的问题.
So how to solve these problems in the dispensing machine industry? There are the following specific points to solve the dispensing machine problems.
1 点胶量的巨细
The size of a dispensing volume
按照工作经验,胶点直径的巨细应为焊盘间距的一半,贴片后胶点直径应为胶点直径的1.5倍。这样就可以保证有充沛的胶水来粘结元件又避免过多胶水浸染焊盘。点胶量几多由螺旋泵的扭转时间长短来抉择,实际中应按照出产环境(室温、胶水的粘性等)选择泵的扭转时间。
According to the working experience, the size of the adhesive spot diameter should be half of the distance between the pads, and the diameter of the adhesive spot should be 1.5 times of the adhesive spot diameter after patching. This ensures that there is plenty of glue to bond components and avoids too much glue to impregnate the pad. The amount of dispensing is determined by the torsion time of the screw pump. In practice, the torsion time of the screw pump should be selected according to the production environment (room temperature, glue stickiness, etc.).
2 点胶压力(背压)
2 dispensing pressure (back pressure)
今朝所用点胶机采用螺旋泵供给点胶针头胶管采纳一个压力来保证足够胶水供给螺旋泵(以CAMALOT5000为例)。背压压力太大易造成胶溢出、胶量过多;压力太小则会呈现点胶断续现象,漏点,从而造成缺陷。应按照同品质的胶水、工作环境温度来选择压力。环境温度高则会使胶水粘度变小、流动性变好,这时需调低背压就可保证胶水的供给,反之亦然。
At present, the dispensing machine uses a screw pump to supply the dispensing needle hose to adopt a pressure to ensure that enough glue is supplied to the screw pump (CAMALOT5000 as an example). Back pressure pressure is too high to cause glue overflow and excessive glue volume; too low pressure will present the phenomenon of intermittent dispensing, leakage point, thus causing defects. Pressure should be selected according to the same quality glue and working environment temperature. High ambient temperature will make the glue viscosity smaller and fluidity better. At this time, it is necessary to reduce back pressure to ensure the glue supply, and vice versa.
3 针头巨细
3 needle size
在工作实际中,针头内径巨细应为点胶胶点直径的1/2,点胶过程中,应按照PCB上焊盘巨细来拔取点胶针头:如0805和1206的焊盘巨细相差不大,可以拔取同一种针头,可是对于相差悬殊的焊盘就要拔取不合针头,这样既可以保证胶点质量,又可以提横跨产效率。
In practice, the inner diameter of the needle should be 1/2 of the diameter of the spot. In the process of dispensing, the needle should be pulled out according to the size of the pad on PCB. If the pad size of 0805 and 1206 is not different, the same needle can be pulled out, but for the pad with great difference, the needle should be pulled out, which can not only ensure the quality of the spot, but also improve the cross-production efficiency.
4 针头与PCB板间的距离
Distance between 4 needles and PCB board
不合的点胶机采用不合的针头,有些针头有必然的止动度(如CAM/A LOT 5000)。每次工作开始应做针头与PCB距离的校准,即Z轴高度校准。
Non-conforming dispensing machines use non-conforming needles, and some needles have a certain degree of locomotion (such as CAM/A LOT 5000). The distance between needle and PCB should be calibrated at the beginning of each work, that is, Z axis height calibration.
5 胶水温度
5 glue temperature
一般环氧树脂胶水应保留在0--5℃的冰箱中,操作时应提前1/2小时拿出,使胶水充实与工作温度相合适。胶水的操作温度应为23℃--25℃;环境温度对胶水的粘度影响很大,温渡过低则会胶点变小,呈现拉丝现象。环境温度相差5℃,会造成50%点胶量变化。因而对于环境温度应加以节制。同时环境的温度也应该给以保证,湿度小胶点易变干,影响粘结力。
Generally, the epoxy resin glue should be kept in the refrigerator at 0 - 5 C, and should be taken out 1/2 hours in advance in order to make the glue full and suitable for the working temperature. The operating temperature of the glue should be 23 - 25 C. The ambient temperature has a great influence on the viscosity of the glue. If the temperature is too low, the glue point will become smaller, showing the phenomenon of wire drawing. The difference of ambient temperature is 5 C, which will cause 50% change of dispensing amount. Therefore, environmental temperature should be controlled. At the same time, the temperature of the environment should also be guaranteed. The adhesive point with small humidity is easy to dry, which affects the bonding force.
6 胶水的粘度
Viscosity of 6 glue
胶的粘度直接影响点胶的质量。粘度大,则胶点会变小,甚拉丝;粘度小,胶点会变大,进而可能渗染焊盘。点胶过程中,应对不合粘度的胶水,拔取合理的背压和点胶速度。
Viscosity of glue directly affects the quality of dispensing. If the viscosity is high, the adhesive point will become smaller, even wire drawing; if the viscosity is low, the adhesive point will become larger, and then the pad may be stained. In the process of dispensing, the glue that is not viscous should be pulled out with reasonable back pressure and dispensing speed.
7 固化温度曲线
7 Curing Temperature Curve
对于胶水的固化,一般出产厂家已给出温度曲线。在实际应尽可能采用较高温度来固化,使胶水固化后有足够强度。
For the curing of glue, the temperature curve has been given by the manufacturer. In practice, higher temperature should be used as far as possible to make the glue strong enough after curing.
The above content is organized and published by Jinan two-component glue punch. More related content can be consulted by clicking on our official website: http://www.jntiannuo.com.
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