1、胶嘴堵塞

1. Blocked rubber nozzle

现象：胶嘴出量偏少活没有胶点出来。

Phenomenon: the output of glue nozzle is too small, and there is no glue point.

产生原因：针孔内未完全清洗干净，贴片胶中混入杂质，有堵孔现象，不相容的胶水相混合。

Cause: the pinhole is not completely cleaned, impurities are mixed in the patch adhesive, the hole is blocked, and incompatible glue is mixed.

解决办法：换清洁的针头，换质量较好的贴片胶，贴片胶牌号不应搞错。

Solution: replace the clean needle with a good quality patch adhesive. The brand of patch adhesive should not be mistaken.

2、拉丝/拖尾

2. Wire drawing / tailing

现象：拉丝/拖尾，点胶中常见缺陷

Phenomenon: common defects in drawing / tailing and dispensing

产生原因：胶嘴内径太小，点胶压力太高，胶嘴离PCB的间距太大，粘胶剂过期或品质不好，贴片胶黏度太高，从冰箱中取出后未能恢复到室温，点胶量太多等。

Causes: the inner diameter of the glue nozzle is too small, the dispensing pressure is too high, the distance between the glue nozzle and PCB is too large, the adhesive is expired or of poor quality, the stickiness of the patch is too high, it fails to return to room temperature after being taken out of the refrigerator, and the dispensing amount is too large.

解决办法：改换内径较大的胶嘴，降低点胶压力，调节“止动”高度，换胶，选择适合黏度的胶种，从冰箱中取出后应恢复到室温(约4h)，调整点胶量。

Solution: change the glue nozzle with larger inner diameter, reduce the dispensing pressure, adjust the "stop" height, change the glue, select the glue type suitable for viscosity, recover to room temperature (about 4h) after taking it out of the refrigerator, and adjust the dispensing amount.

3、固化后，元器件黏结强度不够，波峰焊后会掉片

3. After curing, the bonding strength of components is not enough, and the chips will fall off after wave soldering

现象：固化后，元器件黏结强度不够，低于规范值，有时用手触摸会出现掉片。

Phenomenon: after curing, the bonding strength of components and parts is not enough, which is lower than the specification value. Sometimes the pieces will fall off when touched by hand.

产生原因：固化后工艺参数不到位，特别是温度不够，元件尺寸过大，吸热量大，光固化灯老化，胶水不够，元件/pcb有污染。

Cause: after curing, the process parameters are not in place, especially the temperature is not enough, the component size is too large, the heat absorption is large, the UV curing lamp is aging, the glue is not enough, and the component /pcb is polluted.

解决办法：调整固化曲线，特别是提高固化温度，通常热固化胶的峰值固化温度很关键，达到峰值温度易引起掉片，对光固化胶来说，应观察光固化灯是否老化，灯管是否有发黑现象，胶水的数量，元件/pcb是否有污染。

Solution: adjust the curing curve, especially increase the curing temperature. Generally, the peak curing temperature of the thermal curing adhesive is very important. Reaching the peak temperature is easy to cause chip falling. For the UV curing adhesive, observe whether the UV curing lamp is aging, whether the lamp tube is blackened, the amount of glue, and whether the components /pcb are polluted.

4、孔打

4. Punch

现象：只有点胶动作，无出现胶量。

Phenomenon: only dispensing action, no glue amount.

产生原因：混入气泡，胶嘴堵塞。

Cause: bubbles are mixed and the rubber nozzle is blocked.

解决方法：注射筒中的胶应进行脱气泡处理(特别是自己装的胶)，按胶嘴堵塞方法处理。

Solution: the glue in the injection cylinder should be deaerated (especially the self-contained glue) and treated according to the method of blocking the glue nozzle.

5、固化后元件引脚上浮/移位

5. Floating / shifting of component pins after curing

现象：固化后元件引脚浮起来或移位，波峰焊后锡料会进入焊盘，严重时会出现短路和开路。

Phenomenon: after curing, the component pins float or shift, and the tin material will enter the pad after wave soldering. In serious cases, short circuit and open circuit will occur.

产生原因：贴片胶不均匀，贴片胶量过多，贴片时元件偏移。

Cause: uneven patch glue, too much patch glue, and component offset during patch.

解决办法：调整点胶工艺参数，控制点胶量，调整贴片工艺参数。

Solution: adjust the dispensing process parameters, control the dispensing amount, and adjust the patch process parameters.

6、元器件偏移

6. Component offset

现象：固化元器件移位，严重时元器件引脚不在焊盘上。

Phenomenon: the solidified components are displaced, and the component pins are not on the bonding pad in serious cases.

产生原因：贴片胶出胶量不均匀(例如片式元件两点胶水一个多一个少)，贴片时，元件移位，贴片胶黏力下降，点胶后PCB放置时间太长，胶水半固化。

Cause: the glue output of the chip adhesive is uneven (for example, the glue at two points of the chip component is more than one, and less than the other). When the chip is pasted, the component shifts, the adhesive force of the chip decreases, the PCB is placed for too long after dispensing, and the glue is semi cured.

解决办法：济南双组份打胶机厂家建议您检查胶嘴是否有堵塞，排除出胶不均匀现象，调整贴片机工作状态，换胶水，点胶后PCB放置时间不应过长(小于4h)。

Solution: the manufacturer of Jinan two-component glue applicator suggests that you check whether the glue nozzle is blocked, eliminate the uneven glue discharge, adjust the working state of the mounter, change the glue, and the PCB should not be placed too long (less than 4h) after dispensing.

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